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| M ZG2100M/ZG2101M (R) Wi-Fi Module Data Sheet 2.4 GHz 802.11b Low Power Transceiver Module (c) 2010 Microchip Technology DS70624A - page 1 Note the following details of the code protection feature on Microchip devices: * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." * * * Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. -Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip -intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2010, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-60932-064-5 Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS70624A - page 2 (c) 2010 Microchip Technology ZG2100M/ZG2101M 2.4 GHz 802.11b Low Power Transceiver Module Utility and Smart Energy Thermostats Smart Meters White Goods HVAC - Consumer Electronics Remote Control Internet Radio Home Security Toys - Industrial Controls Chemical Sensors HVAC Security Systems M2M Communication Remote Device Management Location and Asset Tracking Automotive Code Update Retail POS Terminals Wireless Price Tags Digital Remote Signage Medical, Fitness, and Healthcare Glucose Meters Fitness Equipment Patient Asset Tracking Features * * * * * * * * * * * * * * * Single-chip 802.11b including MAC, baseband, RF and power amplifier Data Rate: 1 & 2 Mbps 802.11b/g/n compatible Low power operation API for embedded markets, no OS required PCB or external antenna options Hardware support for AES and RC4 based ciphers (WEP, WPA, WPA2 security) SPI slave interface with interrupt Single 3.3V supply, operates from 2.7V to 3.6V (see section 5) 21mm x 31mm 36-pin Dual Flat pack PCB SM Package Wi-Fi Certified, RoHS and CE compliant FCC Certified (USA, FCC ID: W7O-ZG2100-ZG2101) IC Certified (IC: 8248A-G21ZEROG) Fully compliant with EU & meets the R&TTE Directive for Radio Spectrum Radio Type Approval Certified (Japan, ZG2100M based solution ID: AC164136-2 - 005WWCA0311 005GZCA0149) (c) 2010 Microchip Technology DS70624A - page 3 ZG2100M/ZG2101M Description The ZG2100M & ZG2101M modules are low-power 802.11b implementations. All RF components, the baseband and the entirety of the 802.11 MAC reside on-module, creating a simple and cost-effective means to add Wi-Fi connectivity for embedded devices. The module(s) implement a high-level API, simplifying design implementation and allowing the ZG2100M or ZG2101M to be integrated with 8- and 16-bit host microcontrollers. Hardware accelerators support the latest Wi-Fi security standards. Figure 1: ZG2100M/ZG2101M Module: Functional Block Diagram DS70624A - page 4 (c) 2010 Microchip Technology ZG2100M/ZG2101M Table of Contents 1. 2. 1. Key Features ............................................................................................................................................. 6 Detailed Description ...................................................................................................................................... 7 2.1 ....... Overview ........................................................................................................................................... 7 2.2 ....... Supply Blocks and Boot-Up Sequence for Single 3.3V Supply........................................................ 7 2.3 ....... ZG2100 Power States ...................................................................................................................... 9 2.4 ....... Electrostatic discharge (ESD)......................................................................................................... 10 2.5 ....... JTAG Interface................................................................................................................................ 10 2.6 ....... Serial Interface for Trace ................................................................................................................ 10 2.7 ....... SPI Interface ................................................................................................................................... 10 2.7.1 2.7.2 2.7.3 2.7.4 2.7.5 2.8.1 2.8.2 SPI Slave Interface with Interrupt for Host Operation ....................................................... 10 Host-Control SPI Interface................................................................................................. 10 SPI Timing Characteristics ................................................................................................ 11 SPI Timing ......................................................................................................................... 12 SPI Register Access .......................................................................................................... 13 FIFO Read ......................................................................................................................... 14 FIFO Write ......................................................................................................................... 15 2.8 ....... FIFO Interface................................................................................................................................. 14 2.9 ....... Fully-Integrated Radio .................................................................................................................... 15 2.10 ..... Internal ROM/RAM/NVM ................................................................................................................ 15 2.11 ..... Hardware Support for AES and TKIP ............................................................................................. 15 3. 4. ZG2100M/ZG2101M Pin-Out and Function ................................................................................................ 16 Package Information .................................................................................................................................... 18 4.1. ...... Module Drawing .............................................................................................................................. 18 4.2 ....... Module Layout Guidelines .............................................................................................................. 20 4.3 ....... Module Use Schematic ................................................................................................................... 21 5. 6. Electrical Characteristics ............................................................................................................................. 23 5.1 ....... Power Consumption ....................................................................................................................... 23 Radio Characteristics .................................................................................................................................. 25 6.1 ....... Transmitter 2.4GHz Band ............................................................................................................... 25 6.2 ....... Receiver 2.4GHz Band ................................................................................................................... 25 7. 8. 9. 10. 11. Digital Electrical Characteristics .................................................................................................................. 26 Module Reflow Profile .................................................................................................................................. 27 Ordering Information .................................................................................................................................... 28 Regulatory Notes ......................................................................................................................................... 29 Revision History ........................................................................................................................................... 31 (c) 2010 Microchip Technology DS70624A - page 5 ZG2100M/ZG2101M 1 Key Features Ease of Software Development * * * * * Simple API suited for embedded market Targeted for low resource host processors Entire MAC integrated on-chip Serialized MAC address, each device comes with an unique MAC address in range 001EC0xxxxxx Simple usage model, no requirement for OS Low Power Operation * * * Low power, 250uA sleep mode with fast wake up, 0.1uA hibernate, Sleep power state managed by ZG2100, enabling low average power while maintaining AP association without host control Battery operable from 2.7v to 3.6v (see power specs for limitations) RF * * * * * * * Integrated PA Support for external PA for high RF output power applications Power output +10dBm typical at antenna Power output programmable from +0dBm to meet varying application needs Min RX sens.of-91dBm @ 1MB/Sec. at antenna Integrated PCB antenna (ZG2100M) Support for external antenna available (ZG2101M) Low External Component Count * * Fully integrated RF frequency synthesizer, reference clock, and Integrated PA Single 3.3V supply Wi-Fi & Regulatory * * * Supports 1Mbps & 2Mbps and module-based solutions are "Wi-Fi certified" for 802.11b Hardware support for AES, and RC4 based ciphers (WEP, WPA, WPA2 security) FCC Certified (USA, FCC ID: W7O-ZG2100-ZG2101), IC Certified (IC: 8248AG21ZEROG), Radio Type Approval Certified (Japan, ZG2100M based solution ID: AC164136-2 - 005WWCA0311 005GZCA0149, Wi-Fi Certified, RoHS and CE compliant, and fully compliant with European Market and meet the R&TTE Directive for Radio Spectrum DS70624A - page 6 (c) 2010 Microchip Technology ZG2100M/ZG2101M 2. 2.1 Detailed Description Overview The ZG2100 single-chip 802.11b transceiver includes MAC, baseband, RF and power amplifier, and built in hardware support for AES, and TKIP (WEP, WPA, WPA2 security). The device has an API targeted for embedded markets so an operating system is not required for operation. There is a fully integrated radio ideal for 1 & 2Mbps operation with optional support for external PA and antenna switch operation. The ZG2100M modules incorporate the ZeroG ZG2100 single chip 802.11b transceiver with all associated RF components, crystal oscillator, and bypass and bias passives along with a printed antenna to provide a fully integrated Wi-Fi I/O solution controllable from an 8 or 16bit processor. The ZG2101M module is similar but bypasses the on-board PCB antenna and uses a U.FL connector for connection to an external antenna. Interface is via SPI slave interface with interrupt for HOST operation. The modules support RS232 serial interfaces (requires level shifter) for debug and JTAG boundary scan. Operation is via a single 3.3V supply, supporting various power states, such as hibernate and SLEEP, for end applications long battery life. ZG2100M contains a built in PCB antenna for ease of system integration and significant BOM reduction. The module is manufactured on an FR4 PCB substrate, with components on the top surface only. Connection is made as a surface mount component via flat pack (no pin) connections on two sides. 2.2 Supply Blocks and Boot-Up Sequence for Single 3.3V Supply The internal regulators for the digital and analog core power supplies are enabled by keeping the chip enable pin (CE_N) low. The waveforms for the core supplies, illustrated on the following page, as shown when powering up the ZG2100M/ZG2101M with a nominal 3.3V applied to VDD_3.3. There is an internal power-on-reset detect which starts the boot sequence from the internal ROM when the core supply (VDD_1.8) is up. After approximately 50 ms from when VDD_3.3 supply is within specification, the ZG2100M/ZG2101M is ready for operation. (c) 2010 Microchip Technology DS70624A - page 7 ZG2100M/ZG2101M Figure 2: ZG2100M/ZG2101M Boot Sequence Timing. Refer to Section 4.1 Electrical Characteristics, Note 1. DS70624A - page 8 (c) 2010 Microchip Technology ZG2100M/ZG2101M 2.3 ZG2100 Power States The power state definitions are as follows: VDD_3.3 OFF HIBERNATE SLEEP RX ON TX ON STANDBY 0V 3.3V 3.3V 3.3V 3.3V CE_N 0V 3.3V 0V 0V 0V Circuitry Power disconnected to ZG2100 All internal circuitries are OFF Reference clock and internal bias circuitry are ON Receive circuits are ON Transmit circuits are ON Transition State Only Figure 3: ZG2100M/ZG2101M Power State Diagram (c) 2010 Microchip Technology DS70624A - page 9 ZG2100M/ZG2101M 2.4 Electrostatic discharge (ESD) The ZG2100 IC, integrated within the ZG2100M/ZG2101M, has passed ESD HBM JEDEC Standard No. 22-A114 / 2000 Volts and ESD CDM JEDEC Standard No. 22-C101 / 500V all pins. Users must exercise ESD handling precautions when working with the product either in component form, or exposed PCBs. 2.5 JTAG Interface Joint Test Action Group (JTAG) is the common name used for the IEEE 1149.1 standard entitled Standard Test Access Port and Boundary-Scan Architecture for test access ports used for testing printed circuit boards using boundary scan. ZG2100M/ZG2101M supports JTAG boundary scan. JTAG_EN and JTAG_RST_N need to be driven HIGH to enable JTAG mode. 2.6 Serial Interface for Trace ZG2100M/ZG2101M incorporates Transmitted Data pin (UART0_TX) and Received Data pin (UART0_RX) for serial testing purposes. These pins can be connected to commercially available RS-232 line drivers/ receivers with appropriate external level shifters. The ZG2100 serial interface is fully tested at 115200 bits/seconds baud rate with RS232/UART interface applications. 2.7 2.7.1 SPI Interface SPI Slave Interface with Interrupt for Host Operation The slave Serial Peripheral Interface Bus (SPI) is used to interface with the HOST. The slave SPI interface works with ZG2100M/ZG2101M Interrupt line (INT_NX). When data is available for the HOST during operation, the INT_NX line is asserted low by ZG2100. The INT_NX line is de-asserted high, by ZG2100M/ZG2101M, after the data is transferred to the HOST SPI buffer. The SPI CLK Speed can be up to 25MHz. 2.7.2 Host-Control SPI Interface The slave SPI interface implements the [CPOL=0; CPHA=0] and [CPOL=0; CPHA=1] modes (0 and 3) of operation. That is, data is clocked in on the first rising edge of the clock after Chip Select goes valid. Data on the bus is required to be big endian, with most significant bit on the bus first and least significant bit going last. There are two decode regions. One for register access and one for a FIFO interface. Operation for both regions is shown below. The INT_NX signal allows interrupts to be signaled to the host device. DS70624A - page 10 (c) 2010 Microchip Technology ZG2100M/ZG2101M As an example of any 32-bit register access, suppose a write to register 0xF0_0F18 is desired: Write to host register 0x38 with addr[31:16] (0x00f0). 24 bit transaction. Write to host register 0x39 with addr[15:0] (0x0F18). 24 bit transaction. Write to host register 0x3a with data[31:16]. 24 bit transaction. Write to host register 0x3b with data[15:0]. 24 bit transaction. Write to host register 0x37 with a byte that has the following pattern: 8 bit transaction [7:4] byte enables (active high for the valid bytes that you want to write in steps 3 and 4). [3:0] - 4'b0001 -> activate write to register For a read of 0xF0_0D00: Write to host register 0x38 with addr[31:16] (0x00F0). 24 bit transaction. Write to host register 0x39 with addr[15:0] (0x0F18). 24 bit transaction. Write to host register 0x37 with a byte that has the following pattern: 8 bit transaction [7:4] byte enables (active high for the valid bytes that you want to read in steps 1 and 2). [3:0] - 4'b0011 -> active read of register Read host register 0x3a to get data [31:24] 24 bit transaction Read host register 0x3b to get data [15:0] 24 bit transaction Each of the steps above is a single SPI transaction; the chip select (CE_N) is active low during each step. 2.7.3 SPI Timing Characteristics Characteristic SPI, Data setup to falling clock SPI, Data hold from falling clock SPI SLAVE CLK SPI MASTER CLK Figure 4: ZG2100M/ZG2101M SPI Timing Characteristics Min 1 ns 1 ns 25 MHz 25 MHz Max (c) 2010 Microchip Technology DS70624A - page 11 ZG2100M/ZG2101M 2.74 SPI Timing Figure 5: ZG2100M/ZG2101M SPI Timing Waveform Symbol Tsck Tcs Tcss Tcsh Tsetup Thold Tvalid Tho Parameter SCK Clock Period SCS_N High Time SCS_N Setup Time SCS_N Hold Time SDI Setup Time SDI Hold Time Output Valid Output Hold Time Min 40 ns 50 ns 50 ns 50 ns 10 ns 10 ns Typ Max 15 ns 0 15 ns Figure 6: ZG2100M/ZG2101M SPI Timing Data DS70624A - page 12 (c) 2010 Microchip Technology ZG2100M/ZG2101M 2.7.5 SPI Register Access Figure 7: ZG2100M/ZG2101M SPI Register Access F is a select between FIFO space and register space. If this bit is a 1, the data FIFO space is selected. If this bit is a 0, the register address space is selected. R is the Read/Write bit. If this bit is a 1, the operation is a read. If this bit is a 0, the operation is a write ADDR0 is the starting address for the transaction. This value is only used for register accesses and is ignored during FIFO accesses. WDATAn is the write data byte. This is only used from write operations and is ignored during read operations. RDATAn is the read data byte. This is always valid for both, read and write operations. If contains the current value of any register location. HOST_INTR is the 8-bit interrupt register. (c) 2010 Microchip Technology DS70624A - page 13 ZG2100M/ZG2101M 2.8 FIFO Interface HOST FIFO Basic Commands FCMD[2:0] 0x0 - RFIFO_CMD 0x1 - WCONT (Continue Previous Packet) 0x2 - WSTART0 (Start Packet, head/continue) 0x3 - WSTART1 (Start Packet, head0/continue) 0x4 - WEND CMD 0x5 - REND CMD 2.8.1 FIFO Read Figure 8: ZG2100M/ZG2101M FIFO Read Timing DS70624A - page 14 (c) 2010 Microchip Technology ZG2100M/ZG2101M 2.8.2 FIFO Write Figure 9: ZG2100M/ZG2101M FIFO Write Timing 2.9 Fully-Integrated Radio ZG2100M/ZG2101M incorporates a fully integrated radio Ideal for 1 & 2 Mbps operation with optional support for external PA operation. The direct conversion TX design incorporates an integrated PA, with up to +10dBm typical at antenna, and fully integrated internal power control loop. The direct conversion RX chain utilizes Automatic Gain Control that allows ZG2100M/ZG2101M to receive with a minimum input Level sensitivity (1Mbps @ <8% PER) of -91 dBm typical at the antenna. The ZG2100M/ZG2101M only needs an external crystal for a reference clock. 2.10 Internal ROM/RAM/NVM ZG2100M/ZG2101M incorporates internal ROM, RAM, and NVM. The internal ROM and RAM are reserved only for ZG2100M/ZG2101M operations. The NVM holds information such as the MAC address, TX manufacturing calibration values, and frequency calibration values. 2.11 Hardware Support for AES and TKIP ZG2100M/ZG2101M supports Wi-Fi encryption methodology (AES and RC4 based ciphers). (c) 2010 Microchip Technology DS70624A - page 15 ZG2100M/ZG2101M 3. Pins 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 ZG2100M/ZG2101M Pin-Out and Function Name GND VDD_1.8 JTAG_TDO JTAG_TCK JTAG_TMS JTAG_TDI RST_N DNC JTAG_RST_N GND VDD_1.8 DNC DNC DNC DNC RES VDD_3.3 GND GND CE_N JTAG_EN DNC SCS_N VDD_1.8 GND UART_RX UART_TX GND VDD_3.3 GND VDD_1.8 SDO INT_NX SCK SDI GND L Constant drive Internal Bias Required Bias Resistor Description Ground See below JTAG data out JTAG Clock in JTAG Mode in JTAG data in Chip reset in Do Not Connect JTAG Reset in, pulling this pin low will keep JTAG idle (reset) Ground See below Do Not Connect Do Not Connect Do Not Connect Do Not Connect FLASH Write Protect. See below. 3.3V Power Ground Ground Chip enable in JTAG Enable in, this pin needs to be high for Boundary Scan use Do Not Connect Serial chip select from host (input) See below Ground Debug Serial in Debug Serial out Ground 3.3V Power Ground See below Serial data out to host Interrupt to host (output) Serial clock in from host Serial data in from host Ground H Constant drive H H Constant drive Constant drive Pull-down H Pull-up Constant drive Constant drive DS70624A - page 16 (c) 2010 Microchip Technology ZG2100M/ZG2101M Notes: 1. VDD_1.8 is an internally used supply rail. DO NOT USE these pins to drive other components. 2. Signals that note "Constant drive" must either be constantly driven by the host, or have a pullup or pulldown in case the host is likely to tri-state the signal during power down modes. The constant drive is used to ensure defined operation of the part and to minimize leakage current during low power modes. 3. RES is used as write-protect for the internal module SPI Flash. For production use, this pin should be pulled low. Host control will enable in-field FLASH updates. (c) 2010 Microchip Technology DS70624A - page 17 ZG2100M/ZG2101M 4. 4.1 Package Information Module Drawing Figure 10: ZG2100M Module Physical Dimensions All measurements are in millimeters. Tolerances for measures 0-10 mm is +/- 0.05 mm. Tolerances for measures 10-50 mm is +/- 0.1 mm Figure 11: ZG2101M Module Physical Dimensions All measurements are in millimeters. Tolerances for measures 0-10 mm is +/- 0.05 mm. Tolerances for measures 10-50 mm is +/- 0.1 mm DS70624A - page 18 (c) 2010 Microchip Technology ZG2100M/ZG2101M Figure 12: ZG2100M/ZG2101M Module Layout Pad Dimensions (c) 2010 Microchip Technology DS70624A - page 19 ZG2100M/ZG2101M 4.2 Module Layout Guidelines Figure 13: ZG2100M "Keep Out" Areas. In addition to the guidelines in Figure 13, note the following suggestions: ZG2100M and ZG2101M * Bypass capacitors for VDD_3.3 should be as close as possible. * * * * * * * Do not route any nets to VDD_1.8 Do not use VDD_1.8 to source any external nets. Never place the antenna very close to metallic objects. The external antennas need a reasonable ground plane area for antenna efficiency. ZG2100M onboard PCB antenna specific Do not use a metallic or metalized plastic for the end product enclosure. Keep Plastic enclosure 1cm min height above the ZG2100M PCB antenna while maintaining the keep-out area, as shown in Figure 13. DS70624A - page 20 (c) 2010 Microchip Technology ZG2100M/ZG2101M 4.3 Module Use Schematic Figure 14: ZG2100M/ZG2101M Module Use Schematic. (c) 2010 Microchip Technology DS70624A - page 21 ZG2100M/ZG2101M Figure 15: ZG2101M Antenna Connector/RF port diagram Other Notes: 1. If RST_N is always driven by the HOST, the RC circuit is not needed on this pin. 2. RES is used as write-protect for the internal module SPI Flash. For production use, this pin should be pulled low. Host control will enable in-field FLASH updates. 3. It's recommended to connect UART_RX/TX (pins 26 and 27) to surface mount test points or header points, on the board, for optional connection to Hyperterminal for debugging purposes. Otherwise, they can be left as No Connects. 4. Ensure the HOST always drives the SPI port, even when not in use; otherwise, put 4.7K pull ups, to VDD_3.3, on SDI, SCK, and SCS_N. DS70624A - page 22 (c) 2010 Microchip Technology ZG2100M/ZG2101M 5. Electrical Characteristics Absolute Maximum Ratings: Rating Storage Temperature 3V supply (VDD_3.3) VDD_3.3 SDI, SCS_N, and SCK pins Recommended Operating Conditions: Operating Condition Ambient Temperature Range, commercial parts 3V supply (VDD_3.3) - with FCC and IC cert 3V supply (VDD_3.3) - for ETSI cert 3V supply (VDD_3.3) - for Japan cert Min 0C 2.70V 2.80V 2.97V 3.3V 3.3V 3.3V Typ Max +70C 3.63V 3.63V 3.63V -0.3 V Min -40C 0V Max +125C 4.2V 0.5mSec 5.5 V 5.1 Power Consumption Nominal conditions: 25C, VDD_3.3=3.3V Power Conservation Modes Hibernate, CE_N=3.3v Sleep Standby (transitional power state) Core Supply Rx On, Receive Irx @ -83dBm with 2Mb/Sec. modulated signal input power at antenna port Tx On, Transmit Itx, +0dBm Tx On, Transmit Itx, +10dBm Electrical Characteristics Notes: 1. If VDD_3.3V supply takes longer than Maximum ramp up time, then CE_N or RST_N (held in active states; CE_N=3.3V or RST_N=0V) must be used to delay module boot up until VDD_3.3 is within operating conditions range. 2. For Rx On, RX chain is fully ON. Min Typ Max Unit 0.1 250 10 uA uA mA Min Typ Max Unit 85 115 154 mA mA mA (c) 2010 Microchip Technology DS70624A - page 23 ZG2100M/ZG2101M 3. For Tx On, Pout= 0dBm (measured at antenna); 2Mb/Sec. modulated signal 4. For Tx On, Pout= +10dBm (measured at antenna); 2Mb/Sec. modulated signal 5. 3.3V Current Consumption values represent Typical Peak currents, and the measured currents conditions were done with 85% duty cycle modulated signal. WiFi applications typically operate in less than 85% TX duty cycle. Tx is dependent on such criteria as transmit power setting, and transmit data rate and bandwidth being used. Rx is affected by connectivity distance. 6. All characteristics in this specification are for commercial temperature rated parts only. 7. Operation in EU and/or Japan over extended voltage range of 2.7V to 3.6V will require additional certification testing by customer. The module is capable of this operation. 8. While 3.63V is the maximum operating voltage, the module will detect an overvoltage condition at 4.2V and disable the RF Transmit function. This is an RF Certification behavior pertaining to disabling transmission in unforeseen overvoltage conditions. 9. Listed Absolute Maximum Ratings are not meant for functional operation. Operation at these levels is not guaranteed, and may reduce the operating life of the component. DS70624A - page 24 (c) 2010 Microchip Technology ZG2100M/ZG2101M 6. Radio Characteristics Nominal conditions: 25C, VDD_3.3=3.3V Frequency range F_LO Min 2412 Max 2484 Unit MHz 6.1 Transmitter 2.4 GHz Band Nominal conditions: 25C, VDD_3.3 =3.3V, Flo=2437MHz; 2Mb/Sec. modulated signal duty cycled at 95% measured at recommended single ended balun output (see Figure 8). TX Average Pout (Transmit spectrum mask Compliant) Average Pout gain step resolution from +5 to +10 dBm Average Pout gain step resolution from -5 to +5 dBm Average Pout settled variation -0.5 Min Typ +10 0.5 1.0 0.5 Max Unit dBm dB dB dB 6.2 Receiver 2.4 GHz Band Nominal conditions: 25C, VDD_3.3 =3.3V, Flo=2437MHz; measured at recommended single ended balun input (see Figure 8). RX RX Min Input Level Sensitivity, 1Mbps, 8% PER RX Min Input Level Sensitivity, 2Mbps, 8% PER RX Max Input Level (Power), 1Mbps, 8% PER RX Max Input Level (Power), 2Mbps,8% PER Min Typ -91 -88 -4 -4 Max Unit dBm dBm dBm dBm (c) 2010 Microchip Technology DS70624A - page 25 ZG2100M/ZG2101M 7. Digital Electrical Characteristics Nominal conditions: 25C, VDD_3.3=3.3V Characteristic VIL (Input Low Voltage) VIH (Input High Voltage) VOL (Output Low Voltage) VOH (Output High Voltage) IOL (Low Level Output Current @ VOL Max) IOH (High Level Output Current @ VOH Min) 2.4 8.5 15.4 Min -0.3 2 Typ Max 0.8 5.5 0.4 Unit V V V V mA mA DS70624A - page 26 (c) 2010 Microchip Technology ZG2100M/ZG2101M 8. Module Reflow Profile Figure 16: ZG2100M/ZG2101M Module Reflow Setpoints (c) 2010 Microchip Technology DS70624A - page 27 ZG2100M/ZG2101M 9. Ordering Information Device Description Module Module Comment Commercial grade with PCB antenna Commercial grade for use with an external antenna Ordering Number ZG2100MC ZG2101MC DS70624A - page 28 (c) 2010 Microchip Technology ZG2100M/ZG2101M 10. Regulatory Notes Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. FCC Caution: To assure continued compliance, (example - use only shielded interface cables when connecting to computer or peripheral devices). Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. IMPORTANT NOTE: FCC & IC Radiation Exposure Statement: This equipment complies with FCC & IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This device is intended only for OEM integrators under the following conditions: 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). IMPORTANT NOTE: In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC & IC authorizations are no longer considered valid and the FCC & IC IDs cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining separate FCC & IC authorizations. (c) 2010 Microchip Technology DS70624A - page 29 ZG2100M/ZG2101M End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users (for example access points, routers, wireless ADSL modems, and similar equipment). The final end product must be labeled in a visible area with the following: "Contains FCCID: W7OZG2100-ZG2101 & IC: 8248A-G21ZEROG". IC Certification -- Canada The labeling requirements for Industry Canada are similar to those of the FCC. A visible label on the outside of the final product must display the IC labeling. The user is responsible for the end product to comply with IC ICES-003 (Unintentional radiators) Manual Information That Must be Included The user's manual for end users must include the following in-formation in a prominent location. IMPORTANT NOTE: To comply with FCC & IC RF exposure compliance requirements, the antenna used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. Other notes: ZeroG modules have been built or under development for near body exposure applications. The 20cm statement is a standard note because absorption rate testing (commonly known as SAR or Specific absorption rate) is not modularly transferable for FCC/IC. Thus, if a radio is being used against the body, the end user is still responsible to test for regulatory near body exposure testing (for USA, please refer to the following): FCC Part 1.1037 FCC Part 2.1091 Mobile Devices FCC Part 2.1093 Portable Devices FCC Part 15.247 (b) (4) DS70624A - page 30 (c) 2010 Microchip Technology ZG2100M/ZG2101M 11. Revision History Revision A (March 2010) Revision A includes document updates from version 1.0 to 2.4. (c) 2010 Microchip Technology DS70624A - page 31 M WORLDWIDE SALES AND SERVICE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 852246199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.c om Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 ASIA/PACIFIC India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-41608632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-25661513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-6578-300 Fax: 886-3-6578-370 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 DS70624A - page 32 (c) 2010 Microchip Technology |
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